Newmarket Microelectronics Lab

Increased demand for lower cost, technically advanced and smaller lightweight electronics has changed the electronics assembly landscape. For more than 25 years, Celestica has been a trusted partner to the world’s leading companies in high-reliability markets including aerospace and defense, healthtech, industrial, smart energy and  communications. We manufacture some of the most complex electronics in the world and bring deep expertise in microelectronics  Whether your product requirements have a need for miniaturization, or bare die solutions, our microelectronics capabilities meet world-wide industry standards.

Leveraging over 25 years of manufacturing experience and a 75-year OEM heritage, we offer state-of-the-art:

• ISO class 6 cleanroom
• Flip chip with underfill and precision epoxy die attach
• Wirebonding (gold and aluminum) / Globtop (auger and jetting)
• Complex SMT assembly from 01005s to >75mm BGA package
• PTH, wave solder, wash  and complete backend assembly including conformal coating

Our dedicated laboratory team has extensive experience to ensure the reliability and quality of our work.  We have a long history of test vehicle build and development projects that have been enabled through:  

• Full-service materials lab including; X-ray, Scanning Electron Microscopy (SEM), C-mode Scanning Acoustic Microscopy (CSAM), Fourier Transform Infrared System (FTiR),  X-ray Fluorescence System (XRF), Accelerated Thermal (ATC) Cycling, MultiEnvironment OverStress Testing (MEOST)
• Mechanical stress testing including vibration and shock test
• Reliability chamber testing including ATC, humidity and MEOST chambers